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ElectroComponent Science and Technology
Volume 11, Issue 3, Pages 197-201
http://dx.doi.org/10.1155/APEC.11.197

The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components

Technical University, Dresden, Germany

Received 1 November 1982; Accepted 12 July 1983

Copyright © 1984 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

P. Trägner, “The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components,” ElectroComponent Science and Technology, vol. 11, no. 3, pp. 197-201, 1984. https://doi.org/10.1155/APEC.11.197.