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Active and Passive Electronic Components
Volume 22 (2000), Issue 3, Pages 175-187
http://dx.doi.org/10.1155/2000/35952

Evaluation of Meshed Reference Planes for High Performance Applications

1“POLITEHNICA” University of Bucharest,, Center for Technological Electronics and Interconnection Techniques (CETTI), Splaiul Independentei 313, Bucharest 77206, Romania
2Technical University of Budapest, Department of Electronics Technology, Goldman t. 3, Budapest H-1111, Hungary

Received 29 June 1999; Accepted 20 July 1999

Copyright © 2000 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The actual generations of integrated circuits are characterized, inter alia, by very high frequencies or very high speeds. The dramatic evolution ofthe semiconductor's technology establishes a greater “pressure” to the design and the manufacturing of the passive interconnection structure from PCB/MCM electronic modules. In these conditions the reference planes (power and ground planes) have a more and more important contribution. The paper intents to present the effect of different configuration reference planes on the characteristics of the high speed/high frequency interconnection lines. The first part deals with modeling and simulation of usual practical interconnection geometries. A computer modeling of meshed structures was realized and Spice models for a good compatibility with circuit simulators were obtained. S-, Y-, Z- parameters and radiation patterns were calculated, too. The second part contains measurements made by a vector network analyzer as regards to different practical configurations manufactured at Technical University of Budapest.