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Active and Passive Electronic Components
Volume 23 (2000), Issue 3, Pages 163-173
http://dx.doi.org/10.1155/APEC.23.163

A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

1Thick and Thin Film Device Lab, Department of Physics, Shivaji University, Kolhapur 416004, India
2Centre for Materials for Electronics Technology (C-MET), Panchawati, Dr. Homi Bhaba Road, Pune 411008, India

Received 8 June 2000; Accepted 12 July 2000

Copyright © 2000 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.