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Active and Passive Electronic Components
Volume 25, Issue 2, Pages 169-179
http://dx.doi.org/10.1080/08827510212348

A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects

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Received 1 December 2001

Copyright © 2002 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Umesh Kumar, “A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects,” Active and Passive Electronic Components, vol. 25, no. 2, pp. 169-179, 2002. https://doi.org/10.1080/08827510212348.