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Active and Passive Electronic Components
Volume 2011 (2011), Article ID 823654, 8 pages
http://dx.doi.org/10.1155/2011/823654
Research Article

Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

1Department of Mechanics System Engineering, Toyama Prefectural University, Imizu 939-0398, Japan
2COSEL CO. LTD., 1-6-43 Kamiakae-machi, Toyama 930-0816, Japan

Received 12 April 2011; Revised 4 August 2011; Accepted 6 September 2011

Academic Editor: P. Markondeya Raj

Copyright © 2011 Masaru Ishizuka et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Masaru Ishizuka, Tomoyuki Hatakeyama, Yuichi Funawatashi, and katsuhiro Koizumi, “Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate,” Active and Passive Electronic Components, vol. 2011, Article ID 823654, 8 pages, 2011. doi:10.1155/2011/823654