Journals
Publish with us
Publishing partnerships
About us
Blog
Active and Passive Electronic Components
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Active and Passive Electronic Components
/
2011
/
Article
/
Fig 4
/
Research Article
Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate
Figure 4
Substrate partition.
