Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Table 2

Percentage reduction of in-phase delay for 10-shell MWCNT bundled TSV w.r.t. SWCNT, DWCNT, and 4-shell and 8-shell MWCNT bundle based TSVs.

TSV heights (𝜇m)	% reduction in delay for MWCNT bundle (shell = 10) in comparison to
	SWB	DWB	MWB (shell = 4)	MWB (shell = 8)
50	96.62	91.82	77.08	30.26
100	96.71	92.02	77.53	31.02
150	96.79	92.20	77.85	31.52
200	97.32	93.27	80.92	38.07