Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices

<table class="table-group" id="tab2"><tr><td><table class="table"><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr class="thead"><td class="align_left">Heat insulation thickness (mm)</td><td class="align_center">0.05</td><td class="align_center">0.1</td><td class="align_center">0.15</td></tr><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr><td class="align_left">Temperature (°C)</td><td class="align_center">1250</td><td class="align_center">1503</td><td class="align_center">1680</td></tr><tr class="table-tr"><td colspan="4"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Temperature variation under different heat insulation thickness.</div>

Active and Passive Electronic Components

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Table 2

Table 2: Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices 