Active and Passive Electronic Components

Table of Contents: 1976

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 274587

Electrical Conduction by Percolation in Thick Film Resistors

F. Forlani | M. Prudenziati
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 926150

Semiconductor Materials for Future Display Devices

T. L. Tansley | S. J. T. Owen
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 107546

Conference Report

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 762573

An Experimental Investigation of the Dielectric Properties of Thermally Evaporated Rare Earth Oxides for Use in Thin Film Capacitors

A. T. Fromhold, Jr. | W. D. Foster
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 543820

Wide Band Monolithic Crystal Filters Using Lithium Tantalate

M. C. Hales | J. W. Burgess
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 568172

Book Reviews

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 548681

Conference Report

James F. Burgess
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 718676

Silver-Ruthenium Dioxide Contacts

D. J. Pedder
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 123103

Failure Mechanisms in Wet Tantalum Capacitors

D. Hayward
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 936912

Adhesion Measurement of Thin Films

K. L. Mittal
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 947096

Temperature-stable Barium Titanate Ceramics Containing Niobium Pentoxide

Ian Burn
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 428415

The Direct Bonding of Metals to Ceramics and Application in Electronics

J. F. Burgess | C. A. Neugebauer | ... | R. E. Moore
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 704273

Conference Report

P. L. Moran
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 2
  • - Article ID 283847

Couches Conductrices et Transparentes Obtenues par Pulverisation d'une Cible de SnO2

J. Launey | A. Tosser
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 3
  • - Article ID 975103
  • - Short Communication

Thermoelectric Power in Thick Film Resistors

M. Prudenziati | A. Cattaneo
Active and Passive Electronic Components
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Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
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