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Active and Passive Electronic Components

Active and Passive Electronic Components / Table of Contents: 1977

Table of Contents

Table of Contents: 1977

  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 923175

Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

B. C. Heap | S. A. France
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 270246

Editorial

Frau C. Buck
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 156109

Conduction Processes in High Value Thick Film Resistors

J. Robertson
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 232686

A High Voltage, High Performance Thick Film Resistor System

Sidney J. Stein | Cornelius Huang | Allan S. Gelb
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 4
  • - Article ID 769037

Grain Size Dependence of the Gauge Factor of Thin Metallic Films

C. R. Tellier | A. J. Tosser
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 286151

Ageing Tests on Gold Layers and Bonded Contacts

H. Hieber | F. Betke | K. Pape
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 347378

Techniques for the Examination of Thick Film Resistor Microstructures by T.E.M.

D. J. Pedder
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 392910

Development and Production of Hybrid Circuits for Microwave Radio Links

Per Chr. Malmin
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 169594

Biotelemetry and Radiotracking of Wild Birds: Portable Device Using Solar Cells Power Supply

J. L. Aucouturier | A. Chaillou | ... | M. Marques
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 461457

Tantalum Thin Film Applications – A New Approach for Capacitors

A. Perinati
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 128709

Resistor Geometry Comparison With Respect to Current Noise and Trim Sensitivity

W. Ulbrich
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 495210

Hybrid-Integrated Series-to-Parallel Converters for Gigabit Rates

G. Hanke
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 963715

Hybrid Interconnection of I.C.'S by Means of Patterns on Flexible Tape

A. van der Drift | K. F. Nickl Van Nikelsberg
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 4
  • - Article ID 517910

Editorial

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 4
  • - Article ID 515090

Book Review

J. M. Herbert
Active and Passive Electronic Components
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Acceptance rate10%
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Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
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