Active and Passive Electronic Components

Table of Contents: 1981

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 245087

Permanent Interconnection Technology Electronic Interconnections – the Printed Wiring Board

I. G. Lang
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 615687

Conference Diary

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 956218

Thick Film Circuits: Present State and Future Development

J. Novotny
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 196367

Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains

C. R. Tellier | C. R. Pichard | A. J. Tosser
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 402689

Book Reviews

  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 854932

Selective Glaze for Last Line Visible Thermal Head

Kaoru Hashimoto | Nobuo Kamehara | ... | Koichi Niwa
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 873423

The Influence of Filter Parameters on the Response of Ceramic Filters Operating in the Thickness-Twist Mode

S. Leppävuori | P. Ruuska
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 372616

Fabrication of Nonreciprocal Microwave Components Using Thick Film Ferrimagnetic Pastes

Chinmay. K. Maiti | D. Bhattacharyya | N. B. Chakrabarti
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 414675

The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage

T. Berlicki
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 405353

Response to Comments on Paper on Grain Boundary Scattering Model for Metals

F. Warkusz
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 783076

Development of Substrate Carrier System

N. Miura | Y. Fuura | K. Uchida
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 451269

Photochemical Image Formation Process for High Density Printed Circuit Patterns

Katsuhiro Takahashi | Kunihiro Ikari | ... | Takahiro Tsunoda
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 593972

Editorial

D. S. Campbell
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 680573

Multi-Layer 2 Mil Line Technology

Tamio Saito | Yoshikatsu Fukumoto
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 424689

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Active and Passive Electronic Components
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