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Active and Passive Electronic Components

Active and Passive Electronic Components / Table of Contents: 1981

Table of Contents

Table of Contents: 1981

  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 172842

AVI Transponder

Shoichi Kamata | Yoshinori Kimura | Johji Sakuragi
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 489243

The Application of New Du Pont/USA/Copper Composition for Manufacturing of Thick-Film Microwave Low Loss Resonators on L and X Band

Janusz J. Gondek | Marek A. Wojcicki | Jan Koprowski
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 393840

IC Packaging Technology for Electronic Watches

Yoshio Iinuma
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 352696

Application-Oriented Description of the Quality of Electronic Components (ppm Concept)

Wolfgang Junghans
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 549294

Editorial

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 748437

Thick Film Capacitor Materials of the Powder–Glass Binary Systems and Their Dielectric Properties

Akira Ikegami | Hideo Arima | Katsuo Abe
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 245087

Permanent Interconnection Technology Electronic Interconnections – the Printed Wiring Board

I. G. Lang
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 956218

Thick Film Circuits: Present State and Future Development

J. Novotny
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 196367

Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains

C. R. Tellier | C. R. Pichard | A. J. Tosser
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 320107

Thin Film Technology Used in Bell System Telecommunication Circuits

Walter Worobey
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 302197

High Density Packaging Technology

Yusaku Nishi | Kazuo Mizuno
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 854932

Selective Glaze for Last Line Visible Thermal Head

Kaoru Hashimoto | Nobuo Kamehara | ... | Koichi Niwa
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 873423

The Influence of Filter Parameters on the Response of Ceramic Filters Operating in the Thickness-Twist Mode

S. Leppävuori | P. Ruuska
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 372616

Fabrication of Nonreciprocal Microwave Components Using Thick Film Ferrimagnetic Pastes

Chinmay. K. Maiti | D. Bhattacharyya | N. B. Chakrabarti
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 414675

The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage

T. Berlicki
Active and Passive Electronic Components
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CiteScore1.500
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Impact Factor0.4
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