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Active and Passive Electronic Components

Active and Passive Electronic Components / Table of Contents: 1981

Table of Contents

Table of Contents: 1981

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 405353

Response to Comments on Paper on Grain Boundary Scattering Model for Metals

F. Warkusz
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 783076

Development of Substrate Carrier System

N. Miura | Y. Fuura | K. Uchida
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 451269

Photochemical Image Formation Process for High Density Printed Circuit Patterns

Katsuhiro Takahashi | Kunihiro Ikari | ... | Takahiro Tsunoda
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 593972

Editorial

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 680573

Multi-Layer 2 Mil Line Technology

Tamio Saito | Yoshikatsu Fukumoto
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 259795

Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate for Power Hybrid ICs

N. Miura | Y. Fuura | A. Kazami
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 264179

New Du Pont Composition Applied in Thick-Film Temperature and Humidity Sensors

Janusz J. Gondek | Marek A. Wójcicki
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 719738

New Thick Film Functional Devices

Y. Taketa | O. Abe | M. Haradome
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 213619

Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Keisuke Sugiyama | Isao Bansaku | ... | Iwao Tachikawa
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 243687

Application of Hybrid IC's to the Automotive Electronics Market in Europe

Eckart von Roda
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 920386

Advances in Low Cost Silver-Containing Thick Film Conductors

Barry E. Taylor | John J. Felten | ... | Richard M. Rosenberg
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 484162

An Air Firing Base Metal Resistor and Conductor System for Low Cost Thick Film Circuit Manufacture

E. K. Browne | B. Walton
  • ElectroComponent Science and Technology -
  • Special Issue
  • - Volume 8
  • - Article ID 180824

Integrated Monolithic Crystal Filter for Citizen Band Transceivers

Masaaki Ono | Shigeo Tanji | Hideki Tominaga
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 681247

Processing Considerations of Thick Film Devices With Multilayered Resistors

Nobuyuki Sugishita | Akira Ikegami | Tsuneo Endo
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 930428

Editorial

D. S. Campbell
Active and Passive Electronic Components
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Acceptance rate10%
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Acceptance to publication14 days
CiteScore1.500
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Impact Factor0.4
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