Active and Passive Electronic Components

Table of Contents: 1981

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 258306

Gold Conductor Pastes for High Density Circuit

Shiro Kadota | Koshiro Shibata
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 817952

Studies on the Percentage Variation of Resistance of Polymer Thick Film (PTF) Resistors

Shen-Li Fu | Mong-Song Liang | ... | Tien-Shou Wu
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 290815

Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

M. Nitta | T. Tsuge | ... | R. Kato
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 154917

A Hybridized Monitor Receiver for Low Band FM

Alan T. Brown
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 739123

Solder Paste Process of Hybrid Circuits

Hayato Takasago | Kohei Adachi | ... | Kazuo Tazuke
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 296706

Tape Automated Bonding for High Density Packaging

Karel Kurzweil
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 614562

The Influence of Air-Abrasive Trimming on the Current Noise of Thick Film Resistors

Ying-Nam Lai | Juinn-Jey Chang
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 618079

Thick-Film Laser Trimming Principles, Techniques and Recommendations

Ric Conradt | Lynne S. Marcus
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 308023

Thick Film Circuits for Telecommunications Equipment

William B. Grupen | Howard M. Cohen
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 320107

Thin Film Technology Used in Bell System Telecommunication Circuits

Walter Worobey
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 302197

High Density Packaging Technology

Yusaku Nishi | Kazuo Mizuno
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 9
  • - Article ID 930428

Editorial

D. S. Campbell
  • Active and Passive Electronic Components -
  • Special Issue
  • - Volume 8
  • - Article ID 197050

Editorial

D. S. Campbell
Active and Passive Electronic Components
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Acceptance rate14%
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CiteScore1.800
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