Active and Passive Electronic Components

Table of Contents: 1982

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 593610

Book Review

D. Boswell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 895364
  • - Short Communication

An Inexpensive Diffusion Furnace

M. R. Haskard | J. Bannigan
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 703951
  • - Short Communication

The Effect of Sequential Heat Treatment on Resistance and Temperature Coefficient of Resistance (TCR) of NiCr Thin Films

B. Stepien | K. Wojtczak
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 120728

Allowable Power in NiCr Film Resistors

T. Berlicki | E. Prociów
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 206897

Strange Temperature Characteristics of RuO2-Based Thick Film Resistors

Toshio Inokuma | Yoshiaki Taketa | Miyoshi Haradome
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 972816

Piezoelectric Plastic Microphones

J. A. Grubb
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 739835

Aging Degradation of Ni and NiCr-Ni Thin Film Conductor Systems

A. Gorecka-Drzazga | D. Muszynska
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 543945

The Influence of Electrical Pulses on Thick Film (Du Pont 1421 Birox) Resistors

J. M. Kozlowski | M. Tancula
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 957305

Effect of Firing Temperature and Glass Content on the Electrical Properties of Thick Film Capacitors

S. Leppävuori | A. Uusimäki
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 369585

New Single-Capacitor Simulations of Floating Inductors

R. Senani
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 9
  • - Article ID 143696

Defect Density and Electrical Properties of Vacuum Evaporated Copper Films From Annealing Studies of Electrical Resistance

K. Narayandas | M. Radhakrishnan | C. Balasubramanian
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 493502

Direct Chip Mounting — A Challenge to the Design Engineer

J. Lorman | J. Prochaska
Active and Passive Electronic Components
 Journal metrics
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Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
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