Active and Passive Electronic Components

Table of Contents: 1983

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 762106

Book Review

D. S. Campbell
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 234361

Conference Diary

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 208518

Announcement

  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 736975

Towards a More Thorough Paste Specification

Peter Barnwell
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 815395

Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier

Andre de Keyser | Claude Delautre | Guy Nameche
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 691950

Design of a 108 Pin VLSI Package With Low Thermal Resistance

Kanji Otsuka | Tamotsu Usami
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 814260

Comparative Study of Thick Film Dielectrics

Walter Vermeirsch
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 890219

Electrical Transport in Thick Film (Cermet) Resistors

Maria Prudenziati
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 520185

The Influence of Conductor Particle Size Distribution on the Blending Curve of Epoxy-Based Thick Film Resistors

Bulent Ulug | John M. Robertson | Peter J. S. Ewen
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 586821

Parameters That Influence the Ultrasonic Bond Quality

P. L. L. M. Derks
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 136721

A Large Scale Hybrid Thermal Print Head

Tamio Saito | Yoshikatsu Fukumoto | ... | Masayoshi Nagashima
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 685069

Thick Film Fail-Safe Resistors

St. Nowak | D. L. Wojcicka
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 747519

The Influence of Contaminants During the Firing of Inks

A. J. M. Van Gorp | J. H. C. Van Mourik
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 148726

Guidelines for Finer Lines in Thick Film Circuitry

P. J. B. Bertrams | W. Keuper | ... | J. H. C. Van Mourik
  • Active and Passive Electronic Components -
  • Special Issue
  • Volume 10
  • - Article ID 763405

Hybrids for Automotive Applications

Dietrich Bergfried
Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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