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Active and Passive Electronic Components

Active and Passive Electronic Components / Table of Contents: 1983

Table of Contents

Table of Contents: 1983

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 361625
  • - Short Communication

Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials

R. V. Allen
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 945983

Reliability Assessment and Screening by Reliability Indicator Methods

Jørgen Møltoft
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 265396

Some Useful Design Parameters of Non-Uniform Integrated Band-Pass Filters

H. R. Singh
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 349417

Improvements in Multilayer Ceramic Capacitors

A. F. Dyson
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 762106

Book Review

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 736975

Towards a More Thorough Paste Specification

Peter Barnwell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 815395

Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier

Andre de Keyser | Claude Delautre | Guy Nameche
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 691950

Design of a 108 Pin VLSI Package With Low Thermal Resistance

Kanji Otsuka | Tamotsu Usami
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 814260

Comparative Study of Thick Film Dielectrics

Walter Vermeirsch
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 890219

Electrical Transport in Thick Film (Cermet) Resistors

Maria Prudenziati
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 520185

The Influence of Conductor Particle Size Distribution on the Blending Curve of Epoxy-Based Thick Film Resistors

Bulent Ulug | John M. Robertson | Peter J. S. Ewen
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 586821

Parameters That Influence the Ultrasonic Bond Quality

P. L. L. M. Derks
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 303826

Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts

R. K. Nahar | N. M. Devashrayee
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 136721

A Large Scale Hybrid Thermal Print Head

Tamio Saito | Yoshikatsu Fukumoto | ... | Masayoshi Nagashima
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 685069

Thick Film Fail-Safe Resistors

St. Nowak | D. L. Wojcicka
Active and Passive Electronic Components
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Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
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