Active and Passive Electronic Components

Table of Contents: 1983

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 948943

Electron Tunneling and Hopping Possibilites in RuO2 Thick Films

N. C. Halder
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 701709

The Use of Hybrid Microelectronics in the Construction of Ion-Selective Electrodes

S. I. Leppävuori | P. S. Romppainen
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 835341

Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

Christian M. Val | Jacques D. Agniel
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 505308

A Simulative Approach to Electron Conduction in Thick-Film Resistors

C. Jacoboni | M. Prudenziati | A. Rizzi
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 351708

New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices

Janusz J. Gondek | Marek A. Wójcicki
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 923798

An Electromyographically Controlled Elbow Locking Mechanism for an Upper Limb Prosthesis

H. T. Law | J. J. Hewson
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 487525

Current Noise in Thick and Thin Film Resistors

S. Demolder | A. Van Calster | M. Vandendriessche
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 830385

Displays

A. Schauer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 321817

Conference Report

J. M. Herbert
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 731539

Hybrid Circuit for Stimulated Bone Regrowth

R. Govaerts | W. Sansen | F. de Dijcker
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 319439

Book Review

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 954501

Temperature Verification of Hybrid Microelectronic Circuit Design

Sedat Širbegovic | Milan Mazalica | Ratko Krcmar
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 10
  • - Article ID 856195

Editorial

D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 597809

New Thick-Film Microwave Elements for Microwave Integrated Circuits

Janusz J. Gondek | Marek A. Wójcicki | Jan Cąber
Active and Passive Electronic Components
 Journal metrics
See full report
Acceptance rate10%
Submission to final decision90 days
Acceptance to publication14 days
CiteScore1.500
Journal Citation Indicator0.080
Impact Factor0.4
 Submit Check your manuscript for errors before submitting

We have begun to integrate the 200+ Hindawi journals into Wiley’s journal portfolio. You can find out more about how this benefits our journal communities on our FAQ.