Active and Passive Electronic Components

Table of Contents: 1984

  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 271310

Inaccuracies of Measuring Methods and Their Influence on the Regression Function

W. Sauer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 963627

Scratch-Profiles Study in Thin Films Using SEM and EDS

M. El-Shabasy | L. Pogány | ... | B. Szikora
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 293450

Active Trimming of Hybrid Integrated Circuits

P. Németh | P. Krémer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 395102

Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards

E. Toth | P. Banlaki | ... | J. Pinkola
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 539145

Examination of Thick-Films Using Modern Surface Analytical Techniques

G. Harsányi | G. Ripka
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 674241

Methods of Checking Printed Circuits

I. Hajdu | P. Bánlaki | ... | E. Tóth
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 570963

Analysis of Thin Film Fire Sensors

G. Zentai | Zs. Illyefalvi-Vitéz
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 213830

Noise Investigations on Thick Film Resistors

A. Ambrozy | G. Wollitzer
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 808925

The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components

P. Trägner
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 163796

Editorial

V. Rysanek
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 391890

Model for Reliability Prediction of Thick Film Resistors

R. B. Pranchov | D. S. Campbell
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 697139

Evaporation Characteristics of Electron Beam Gun Heated Sources

Paul C. Baynes | T. Nagarajan
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 408641
  • - Short Communication

Fabrication of Schottky-Barrier Diodes Using a Thick Film Technique

R. Sarin | Y. R. Pradeep
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 318375

Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach

A. Kerkhoff
  • ElectroComponent Science and Technology -
  • Special Issue
  • Volume 11
  • - Article ID 623069

Card-Edge Connector Reliability

Poul Villien
Active and Passive Electronic Components
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