Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part III


Status
Published

The First European Hybrid Microelectronics Conference. Part III

Articles

  • Special Issue
  • - Volume 5
  • - Article ID 868506

Conference Reports

  • Special Issue
  • - Volume 5
  • - Article ID 961276

Book Reviews

D. S. Campbell
  • Special Issue
  • - Volume 5
  • - Article ID 926425

A Thick Film Base Metal Resistor and Compatible Hybrid System

F. E. Buzan | J. D. Grier | ... | H. Thoryk
  • Special Issue
  • - Volume 5
  • - Article ID 507808

Thin Resistive Thick-Film Layers Based on Precious Metal Resinate/Glass Systems

P. Prinsen
  • Special Issue
  • - Volume 5
  • - Article ID 247463

The Structure and Properties of Reactively Bonded Thick Film Gold Conductors

M. V. Coleman | G. E. Gurnett
  • Special Issue
  • - Volume 5
  • - Article ID 106230

Chemical Reaction and Electrical Properties of Amorphous RuO2-Ag-Glass Ternary System

Akira Ikegami | Kiichi Shinriki
  • Special Issue
  • - Volume 5
  • - Article ID 728456

The Development of Precision Thin Film Resistors for Submerged Repeater Applications

D. O. Spiller
  • Special Issue
  • - Volume 5
  • - Article ID 293947

Hybrid Realisation of High Precision Analog Conversion Modules

L. Kun
  • Special Issue
  • - Volume 5
  • - Article ID 614872

A Mass Production of Thick-Film Car Voltage Regulators

D. A. Bianchi | P. Faravelli | G. S. Rodari
  • Special Issue
  • - Volume 5
  • - Article ID 630270

Hybrids in Telecommunications

D. Roggia
Active and Passive Electronic Components
 Journal metrics
Acceptance rate14%
Submission to final decision54 days
Acceptance to publication35 days
CiteScore1.100
Impact Factor-
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