The paper describes development of a low inductance thin film resistor series with a stability of &#177;0.15&#37; change in
resistance, over a 25 year life, in a submerged repeater environment. (40&#37; RH maximum and 0 to 30&#8451; ambient
temperature).It was first necessary to establish an appropriate mathematical model relating resistor stability with time and
temperature. This was devised from experimental data based on measured resistor drift at various temperatures, and
enabled acceleration of resistor drift to be carried out to ensure that each resistor possessed the required stability.Deposition of a secondary nichrome layer protects the gold/nichrome interface and promotes SiO2 adhesion.
This results in an improvement in the basic elevated temperature resistor stability by minimising diffusion effects of
nichrome into the conductor, and protection against electrochemical corrosion as demonstrated by 10,000 hours life
test at 83&#37; RH &#64; 28&#8451; on 5 mW load and by elevated temperature tests under electrical loading.

D. O. Spiller

The Development of Precision Thin Film Resistors for Submerged Repeater Applications

D. S. Campbell

Book Reviews

High precision analog modules are manufactured using film technologies. Components which are critical as regards
operation and stability are made by thin film technology, additional elements and interconnection of active
components are made using thick film technology.Using these two separate manufacturing methods to obtain high stability and accuracy, optimum cost and yield
can be achieved. To illustrate these facts, two circuits are discussed in detail, a voltage to frequency converter and a
log amplifier.

L. Kun

Hybrid Realisation of High Precision Analog Conversion Modules

The relationship between composition, electrical properties, and the chemical reaction during firing of amorphous
RuO2-Ag-Glass ternary system are investigated. The results are as follows.1) Iso-resistivity, iso-TCR and iso-noise index curves of the system are determined. They have a common feature
with regard to their bending in the composition region containing less than about 10wt&#37; Ag.2) X-ray diffraction and thermal differential analysis reveals the solution of Ag into glass phase in addition to
the crystallization of amorphous RuO2.3) The triaxial diagram of isothermal section at 850&#8451; is given.4) Electrical isograms in the system are discussed in relation to the solubility of Ag into glass phase.

Akira  Ikegami

Kiichi  Shinriki

Chemical Reaction and Electrical Properties of Amorphous RuO2-Ag-Glass Ternary System

The properties of reactively bonded gold conductors have been compared with a fritted gold conductor (DuPont
9260). Several different additives in the gold conductors were examined, including copper/copper oxide; copper
plus cadium/germanium and copper cadium and bismuth.The adhesion strength of all the conductors was found to be superior to the fritted standard, but the electrical
conductivity did not appear to be improved. These materials thus offer advantages where stronger adhesion is
required or possibly, where the interface between conductor and substrate needs to be well-defined.

M. V. Coleman

G. E. Gurnett

The Structure and Properties of Reactively Bonded Thick Film Gold Conductors

This paper describes the preparation and results obtained with a ruthenium-resinate/glass resistive system prepared
by firing on to a 96&#37; alumina substrate. The results have been compared with a gold/rhodium-resinate/glass system. It
is found in the ruthenium system that the particle size is about 200 &#8491; and because of this, conduction occurs at a
very low volume percent conduction phase. Temperature Coefficient of Resistance behaviour of the ruthenium
based system is still anomalous.

P.  Prinsen

Thin Resistive Thick-Film Layers Based on Precious Metal Resinate/Glass Systems

Non-noble metal thick film materials have been the topic of several recent papers. 11 ,13 ,14,15 This paper will focus on the
first non-noble metal thick film system comprising conductors, dielectrics and most important, resistors for commercial
use. Processing and performance data are presented in detail to illustrate the capabilities of these new materials.
Circuit applications information is presented wherever possible. This new class of materials will enable the microelectronics
industry to exploit new market opportunities previously unavailable due to the high costs of precious
metal materials.

F. E. Buzan

J. D. Grier

B. E. Bertsch

H.  Thoryk

A Thick Film Base Metal Resistor and Compatible Hybrid System

The technological solutions chosen for a car-voltage regulator now in mass production (thick-film hybrid with
standard encapsulated active devices) are discussed from the point of view of functional performance, producibility
and reliability.

D. A. Bianchi

P.  Faravelli

G. S. Rodari

A Mass Production of Thick-Film Car Voltage Regulators

The telecommunication industry has greatly contributed to the diffusion of hybrid technology in all electronic fields.
The approach, followed by almost every telecommunication company, in order to optimize the implementation of
hybrid circuits, is to use both thin and thick film technologies. After a short review of the characteristics of the
telecommunication market, which affect hybrid technology, the adaptive and simple but powerful approach of
Telettra will be presented.

D.  Roggia

Hybrids in Telecommunications

It is shown that both European and American standardization committees specify the dimensions in the same
grid and that there is no standardization of the thickness in relation to the capacitance.Of the ceramic dielectrics, special attention is paid to the instability of capacitance and losses of type II
materials due to temperature and voltage treatment.The conductivity of the inner electrodes determines the losses at 1 MHz in type I dielectrics. It is shown
that the economically interesting partial replacement of Pd by Ag can cause an increase in the losses: other
substitute metals seem more promising.The last aspect discussed is the end terminations of the capacitors. In the case of silver/palladium end
terminations the Ag/Pd ratio should be smaller than two.

W.  Noorlander

Some Aspects of Multilayer Ceramic Chip Capacitors for Hybrid Circuits

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