This paper is a report of a discussion panel held at the First European Conference on Hybrid Microelectronics,
concerning the Economics of Hybrid Production. Figures were presented at the discussion showing the sizes of the
markets in the U.S.A. and in Europe, demonstrating the percentage of total hybrid markets associated with thin film
technology and also the percentage of the market associated with hermetically packaged circuits. It was shown that
the growth rate in hybrid technology is similar to that predicted for integrated circuits, a result which can be
explained in terms of the interconnection facility which hybrid technology offers.

D.  Boswell

D. S. Campbell

Economics of Thick and Thin Film Hybrid Production in Europe

Holger  Meinel

Bernhard  Rembold

Werner  Wiesbeck

Optimisation of Thin and Thick Film Technology for Hybrid Microwave
Circuits

Lead glass passivation (glassivation) of semiconductor chips has been investigated. Glassivation of BC107 type
transistor chips has resulted in improved robustness and their ability to withstand ionic contamination better than
control chips. Increased yields were observed when glassivated transistor chips were assembled in ceramic flat
packages.

B. C. Heap

S. A. France

Improved Hybrid Circuit Assembly Yields and Reliability by
Glassivation of the Semiconductor Chip

Using a library of available I.C. chips, and a network description of the circuit in terms of these chips, the program
CALHYM produces a 100&#37; complete layout of a multilayer hybrid microcircuit in three steps: the partitioning of
the logic functions into library chips, the placement of the used chips on the substrate and the routing of the
interconnections.CALHYM is written in Fortran IV and runs on a minicomputer with interactive graphic facilities.

H.  Beke

S.  Mazur

R.  Govaerts

W.  Sansen

R.  Van Overstraeten

CALHYM: A Computer Program for the Automatic Layout of Large Digital
Hybrid Microcircuits

Our simple model of the noise of a thick-film resistor leads to two limiting cases. For thick-film resistors with a
conduction dominated by the glass interface, the relative noise is proportional to the sheet resistance, R&#9633;. For thick
film resistors, where the conduction is mainly dominated by the current constrictions in the contact areas between
grains, the relative noise is proportional to <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:msubsup><mml:mtext>R</mml:mtext><mml:mo>&#x25A1;</mml:mo><mml:mn>3</mml:mn></mml:msubsup></mml:mrow></mml:math>. Both trends have been observed. Some criteria of low-noise thick-film
resistors are derived from the developed noise relations.The major conclusion is that measurements of the noise index are a nondestructive way to check quantitatively
the operations used to manufacture high-quality thick-film resistors. Inadequate materials or treatments, weak or
brittle wire bonds and reliability are easily detected by 1/f noise measurements.

L. K. J. Vandamme

Criteria of Low-Noise Thick-Film Resistors

Various factors affecting precision of trim and resistor stability are considered. The influence of machine operating
parameters (beam power, pulse frequency and trim speed) on resistor performance are examined and quantified
through statistically designed experiments for a <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>Q</mml:mi></mml:math>-switched YAG laser system. Laser kerf quality is examined by
scanning electron microscopy and related to kerf isolation resistance measurements. A relatively simple, production
oriented, quality control test is proposed for rapid determination of kerf electrical stability. In addition, the effect
of cut design and extent of trim on precision and stability are discussed.

R. E. Cote

R. C. Headley

J. T. Herman

A.  Howe

Factors Affecting Laser-Trim Stability of Thick Film Resistors

P. L. Moran

Book Review

Frau C. Buck

Editorial

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

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Active and Passive Electronic Components

The First European Hybrid Microelectronics Conference. Part II

The First European Hybrid Microelectronics Conference. Part II

Articles

Economics of Thick and Thin Film Hybrid Production in Europe

Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits

Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

CALHYM: A Computer Program for the Automatic Layout of Large Digital Hybrid Microcircuits

Criteria of Low-Noise Thick-Film Resistors

Factors Affecting Laser-Trim Stability of Thick Film Resistors

Book Review

Editorial