TY - JOUR
A2 - Zheng, Li Wu
AU - Bakhsh, T. A.
AU - Turkistani, A.
PY - 2021
DA - 2021/06/09
TI - The Effect of Thermocycling on Interfacial Bonding Stability of Self-Etch Adhesives: OCT Study
SP - 5578539
VL - 2021
AB - Objective. The aim of this study was to monitor the behavior of interfacial gaps formed under different bonded polymeric restorations before and after thermocycling (TC), using swept-source optical coherence tomography (SS-OCT) and confirming the obtained findings with confocal laser scanning microscopy (CLSM). Materials and Methods. Cylindrical class I cavities were prepared in twenty noncarious human premolar teeth (1.5 mm depth×3.5 mm diameter) and divided randomly into two groups: TS and SN, according to the adhesive system (n=10). In the TS group, one-step self-etch adhesive Clearfil Tri-S Bond Plus (Kuraray Noritake Dental, Japan) was used, followed by composite restoration using Estelite Sigma Quick (Tokuyama Dental, Japan). In the SN group, the cavities were restored with the two-step self-etch/composite silorane-based resin restoration system (3M ESPE, USA). All specimens were restored in bulk filling technique and cured in accordance with the manufacturers’ instructions. Both groups were imaged under SS-OCT after 24 h and recorded as controls. Then, each group was subjected to thermal challenge using the TC machine (5–55°C) and B-scans were recorded at different TC intervals (2600, 5200, and 10000). In order to confirm the SS-OCT findings, additional specimens were prepared, scanned, and sectioned for CLSM observation. Results. B-scans demonstrated white clusters at the tooth-resin interface that corresponded to the gap location on CLSM images. The TS group showed significantly less gap formation than the SN group before and after TC (p<0.001). Conclusions. An optimal composite adaptation can be achieved when the bonded restoration comprises a combination of an adhesive containing 10-MDP monomer and a considerable highly filled composite.
SN - 2314-6133
UR - https://doi.org/10.1155/2021/5578539
DO - 10.1155/2021/5578539
JF - BioMed Research International
PB - Hindawi
KW -
ER -