Research Article
On-Orbit Thermal Design and Validation of 1 U Standardized CubeSat of STEP Cube Lab
Table 7
Summary of conductor values used in the analysis.
| | Coupling condition | Type of contact | Contact values | Remarks |
| | Structure/external panel | Surface to Surface [W/m2-°C] | 417.6 | Bolting | | Structure/interface board | 30.00 | Bolting | | External panel/solar cell | 30.00 | — |
| | MEMS thruster/structure | Node to Node [W/°C] | 0.001 | Delrin | | RER,VER/interface board | 0.001 | G10 washer | | PCM/payload board | 0.001 | G10 washer | | Electrical board/board | 0.001 | PCB supporter | | Battery/power board | 0.407 | Partial clamping | | SEC/solar cell | 0.001 | Bonding |
|
|
