Research Article
On-Orbit Thermal Design and Validation of 1 U Standardized CubeSat of STEP Cube Lab
Table 9
On-orbit temperature prediction using the correlated TMM with TB test.
| Component | Before correlation (°C) | After correlation (°C) | Hot operation | Cold operation | Cold emergency | Hot operation | Cold operation | Cold emergency | | | | | | |
| panel | 56.67 | −39.21 | −40.57 | 56.20 | −43.90 | −44.75 | panel | 50.75 | −25.06 | −25.84 | 49.89 | −33.64 | −34.52 | panel | 22.95 | −37.40 | −38.40 | 33.54 | −42.08 | −44.75 | panel | 30.88 | −31.11 | −32.16 | −3.78 | −39.13 | −43.36 | I/F board | 13.60 | −30.50 | −31.54 | 36.16 | −25.60 | −25.77 | GPS board | 18.62 | −2.07 | −4.35 | 15.67 | −8.19 | −8.80 | OBC board | 17.24 | −8.54 | −10.28 | 26.62 | −15.68 | −18.21 | Comm. board | 20.94 | −4.02 | −6.13 | 19.46 | −9.47 | −11.98 | Power board | 20.61 | −11.22 | −12.55 | 14.61 | −20.49 | −22.76 | Battery | 35.78 | −1.38 | −3.49 | 26.90 | −3.78 | −8.07 | MEMS | 25.67 | −3.71 | −4.79 | 30.96 | −26.77 | −30.41 | SEC | 67.63 | −29.68 | −30.50 | 58.20 | −35.20 | −36.18 | PCM | 19.71 | −3.16 | −5.23 | 19.52 | −7.18 | −9.39 | HRM | 15.66 | 3.10 | 1.27 | 17.25 | 2.03 | −0.20 |
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