On-Orbit Thermal Design and Validation of 1 U Standardized CubeSat of STEP Cube Lab

Table 9

On-orbit temperature prediction using the correlated TMM with TB test.

Component	Before correlation (°C)			After correlation (°C)
	Hot operation	Cold operation	Cold emergency	Hot operation	Cold operation	Cold emergency
	panel	56.67	−39.21	−40.57	56.20	−43.90	−44.75
panel	50.75	−25.06	−25.84	49.89	−33.64	−34.52
panel	22.95	−37.40	−38.40	33.54	−42.08	−44.75
panel	30.88	−31.11	−32.16	−3.78	−39.13	−43.36
I/F board	13.60	−30.50	−31.54	36.16	−25.60	−25.77
GPS board	18.62	−2.07	−4.35	15.67	−8.19	−8.80
OBC board	17.24	−8.54	−10.28	26.62	−15.68	−18.21
Comm. board	20.94	−4.02	−6.13	19.46	−9.47	−11.98
Power board	20.61	−11.22	−12.55	14.61	−20.49	−22.76
Battery	35.78	−1.38	−3.49	26.90	−3.78	−8.07
MEMS	25.67	−3.71	−4.79	30.96	−26.77	−30.41
SEC	67.63	−29.68	−30.50	58.20	−35.20	−36.18
PCM	19.71	−3.16	−5.23	19.52	−7.18	−9.39
HRM	15.66	3.10	1.27	17.25	2.03	−0.20