Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

<div>Location and number of cracked solder joints for each specimen.</div>

International Journal of Aerospace Engineering

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Figure 10

Figure 10: Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 

Figure 10 | Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 