Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

<div>1st eigenfrequencies of PCB for the compression ratio of the thermal gap pad in each case.</div>

International Journal of Aerospace Engineering

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Figure 14

Figure 14: Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 

Figure 14 | Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 