Research Article
Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation
Table 3
Specifications of CCGA624 package [
18].
| Item | Value |
| Manufacturer | Microsemi Corporation |
| Configuration | |
| Column | Composition | 80Pb/20Sn (with copper ribbon) | Dimension (mm) | 2.21 × 0.51 (height × diameter) |
| Package | Dimension | 32.5 × 32.5 × 2.25 | Number of column pins | 624 | Lead pitch (mm) | 1.27 |
| Total weight (g) | 13.28 (including 2.36 g for solder columns) |
| JEDEC Registration | JEDEC MO-158 VAR BE-1 |
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