Improving the Slippage Resistance of Successors of the Mars Instrument “Heat Flow Property Package Instrument” (HP<sup>3</sup>) Using Bekker’s Spaced-Linked Track

<div>Schematic top view of the new proposed design.</div>

International Journal of Aerospace Engineering

fig9

Figure 9

Figure 9: Improving the Slippage Resistance of Successors of the Mars Instrument “Heat Flow Property Package Instrument” (HP<sup>3</sup>) Using Bekker’s Spaced-Linked Track 

Figure 9 | Improving the Slippage Resistance of Successors of the Mars Instrument “Heat Flow Property Package Instrument” (HP3) Using Bekker’s Spaced-Linked Track 