A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair

<table class="table-group" width="800px"><tr class="fig-image" id="a"><td><img alt="389516.fig.006a" src="https://static.hindawi.com/articles/ijap/volume-2013/389516/figures/389516.fig.006a.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(a) </b>Single via  </td></tr></table></td></tr><tr class="fig-image" id="b"><td><img alt="389516.fig.006b" src="https://static.hindawi.com/articles/ijap/volume-2013/389516/figures/389516.fig.006b.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(b) </b>Differential vias </td></tr></table></td></tr></table>

<table>Equivalent circuit of top (bottom) layer microstrip to the upper (lower) part of the via vertical conversion structure. </table>

International Journal of Antennas and Propagation

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Figure 6

Figure 6: A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair 