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International Journal of Antennas and Propagation
Volume 2015, Article ID 470952, 14 pages
http://dx.doi.org/10.1155/2015/470952
Research Article

Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

School of Electronic and Information Engineering, Beihang University, No. 37 Xueyuan Road, Haidian District, Beijing 100191, China

Received 24 July 2015; Revised 3 November 2015; Accepted 4 November 2015

Academic Editor: Felipe Cátedra

Copyright © 2015 Zhaowen Yan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Zhaowen Yan, Ting Kang, Wei Zhang, and Jianwei Wang, “Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration,” International Journal of Antennas and Propagation, vol. 2015, Article ID 470952, 14 pages, 2015. https://doi.org/10.1155/2015/470952.