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International Journal of Antennas and Propagation
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International Journal of Antennas and Propagation
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2015
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Article
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Fig 10
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Research Article
Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
Figure 10
parameters of the TSV model with different bump height.
(a)
and
(b)
Far coupling
(c)
Near coupling