Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

Figure 15

parameters result of Model 2. (a) Insertion loss of each TSV, (b) the cross talk from the aggressive TSV to TSV1 at 20 GHz, and (c) the cross talk from the aggressive TSV to TSV2 at 20 GHz.

(a)

(b)

(c)