Table of Contents Author Guidelines Submit a Manuscript
International Journal of Antennas and Propagation
Volume 2016 (2016), Article ID 9562854, 8 pages
http://dx.doi.org/10.1155/2016/9562854
Research Article

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

School of Physical Electronics, University of Electronic Science and Technology of China, No. 4, Section 2, North Jianshe Road, Chengdu 610054, China

Received 1 December 2015; Revised 2 February 2016; Accepted 21 February 2016

Academic Editor: Diego Masotti

Copyright © 2016 M. X. Yu. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

M. X. Yu, “A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages,” International Journal of Antennas and Propagation, vol. 2016, Article ID 9562854, 8 pages, 2016. doi:10.1155/2016/9562854