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International Journal of Antennas and Propagation
Volume 2017 (2017), Article ID 1297931, 10 pages
Review Article

Review of 3D Printed Millimeter-Wave and Terahertz Passive Devices

1College of Electronics and Information Engineering, Sichuan University, Chengdu 610064, China
2Department of Electrical and Computer Engineering, Faculty of Engineering, National University of Singapore, Singapore 117583
3School of Physics and Optoelectronic Engineering, Guangdong University of Technology, Guangzhou 510006, China
4National Key Laboratory on Electromagnetic Environmental Effects and Electro-Optical Engineering, PLA University of Science and Technology, Nanjing 210007, China
5School of Electronic Engineering, Chengdu University of Information Technology, Chengdu 610225, China

Correspondence should be addressed to Yanjie Wu

Received 23 March 2017; Revised 10 June 2017; Accepted 19 June 2017; Published 24 July 2017

Academic Editor: Xiulong Bao

Copyright © 2017 Bing Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The 3D printing technology is catching attention nowadays. It has certain advantages over the traditional fabrication processes. We give a chronical review of the 3D printing technology from the time it was invented. This technology has also been used to fabricate millimeter-wave (mmWave) and terahertz (THz) passive devices. Though promising results have been demonstrated, the challenge lies in the fabrication tolerance improvement such as dimensional tolerance and surface roughness. We propose the design methodology of high order device to circumvent the dimensional tolerance and suggest specific modelling of the surface roughness of 3D printed devices. It is believed that, with the improvement of the 3D printing technology and related subjects in material science and mechanical engineering, the 3D printing technology will become mainstream for mmWave and THz passive device fabrication.