Research Article

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Figure 8

Leaching kinetics of Sn from Sn-Ag-Cu, Sn-Cu-Ni, and Sn-Cu alloy and their joints in 3.5 wt.% NaCl solution.