Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

<div>Surface morphology analysis of Sn-Cu-Ni (a) solder alloy and (b) solder joint and their corresponding EDS spectra after 30-day leaching measurements in 3.5 wt.% NaCl solution.</div>

International Journal of Corrosion

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Figure 9

Figure 9: Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution 