| Adhesive system | Composition | Bonding technique |
| Self-etch | Monomers: MMA, 4-META, UDMA, 2-hydroxyethyl methacrylate, acetone, water | Scrubbed with monomer-soaked sponge on tooth surface for 20 s, air-dried 5 s, once more scrubbed, air-dried 10 s, light-cured 10 s | AQ-Bond (Touch & Bond) | Sponge: polyurethane foam, p-TSNa | Bulk filled with resin-composite, light-cured 60 s |
| Self-etch | Primer: 10-MDP, 12 MDPB, HEMA, hydrophilic dimethacrylates, water | Applied primer for 20 s, air-dried 5 s, applied monomers, air-dried 5 s, light-cured 10 s | Clearfil Protect Bond (Clearfil SE Protect) | Monomers: MDP, Bis-GMA, HEMA, hydrophobic dimethacrylate, N, N-diethanol-p-toluidine, silanated colloidal silica, surface-treated sodium fluoride | Bulk filled with resin-composite, light-cured 60 s |
| Moist bonding | Etchant: 32% H3PO4, water | Applied etchant for 15 s, rinsed off 15 s, air-dried 2 s, kept moist | All-Bond 2 | Primer: 2% NTG-GMA, 16% BPDM, acetone | Mixed primer 1 : 1 drop for 3 s, 5 coatings on tooth surface, air-dried 5 s, light-cured 20 s | Bonding: bis-GMA, UDMA, HEMA | Applied bonding agent and bulk filled with resin-composite, light-cured 60 s |
| Dry bonding | Etchant: 10% citric acid, 3% FeCl2 (10–3), water | Applied etchant for 10 s, rinsed off 10 s, air-dried 10 s | Super-Bond D-Liner II PLUS (Amalgam Bond Plus) | Monomers: 2, 2-bis[4-(methacryloxy polyethoxy) phenyl]propane, HEMA, 4-META, MMA, TBB | Mixed 2 drops of monomer:1 drop TBB, applied on tooth surface using brush dip technique, autocured | | Powder: PMMA | Bulk filled with amalgam |
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