Table 5: Summary of die.

Process Technology90 nm 7M1P CMOS

Logic1.8 M gates
Memory and ADC18.4 M bit/4 ADC
Supply Voltage1.2 V core, 3.3 V I/O
Active Power310 mW typical
Die Size7.0 mm 7.0 mm
Package12 mm 12 mm
144FBGA