Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
Figure 6
(a) LSV curves of the BDD and Cu/Pd-modified BDD electrodes in BR buffer solution (pH 9). Nitrate response of the Cu/Pd composite electrodeposited on BDD electrode at different (b) deposition time, (c) deposition potential, and (d) Cu(II) : Pd(II) ratio. The nitrate response in (b) (c), and (d) was investigated in 0.1 M KNO3 + BR buffer solution (pH 9). The Cu/Pd composite used in (a), (b), and (c) was electrodeposited using 5 mM Cu(II) + 1 mM Pd(II) + 0.5 M HClO4. Scan rate of 10 mV s−1.