Research Article
Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell
Figure 13
SEM micrographs taken at different regions on the substrate: 1 cm, 3 cm, and 6 cm showing the surface morphology of the electrodeposited Cu film fabricated at 2 mA cm−2 (a)–(c); 4.1 mA cm−2 (d)–(f); and 8.2 mA cm−2 (g)–(i).
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| (b) |
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| (i) |