Reduction of the Electrode Overpotential of the Oxygen Evolution Reaction by Electrode Surface Modification

Figure 2

OCP of the Ni-deposited mesh in 6.0 M KOH solution plotted as a function of electrodeposition time. The etching solution used was a mixture of 1 M H₂O₂ and 2 M HCl, and the etching time was 5 min. Ni was deposited at a current density of 0.2 A cm⁻².