A Reuse Evaluation for Solar-Cell Silicon Wafers via Shift Revolution and Tool Rotation Using Magnetic Assistance in Ultrasonic Electrochemical Micromachining
Figure 4
Amount of Si3N4 layer and epoxy film removed using different combinations of frequency, ultrasonic power, and electrolyte flow rate (phosphoric acid, NaNO3 15% wt, PO4-3-P 5% wt, 60°C, continuous DC, 150 A, 80 V, 4000 Gauss, shift 800 rpm, and tool 900 rpm).
