Research Article

A Reuse Evaluation for Solar-Cell Silicon Wafers via Shift Revolution and Tool Rotation Using Magnetic Assistance in Ultrasonic Electrochemical Micromachining

Figure 9

Amount of Si3N4 layer and epoxy film removed at different feed rates of workpiece using different diameters ( ) of cathode and different sizes of gap between the anode and cathode (phosphoric acid 25% wt, NaNO3 15% wt, PO4-3-P 5% wt, 60°C, 40 L/min, continuous DC, 150 A, 100 kHZ/150 W, 4000 Gauss, shift 800 rpm, and tool 900 rpm).
293859.fig.009a
(a) Amount of Si3N4 layer removed
293859.fig.009b
(b) Amount of epoxy film removed