Material Properties of Laser-Welded Thin Silicon Foils
Figure 3
Cross-sections mappings of a spot welded sample, the laser beam was introduced from the top side. (a) Plot of the micro-Raman Lorentz peak area in arbitrary units. (b) EBSD mapping, color with respect to the wafer surface, grain boundaries are colored as followed: Σ3 in blue, Σ9 in green and angles between 15.0° to 62.8° in black. Definitions for the crystal orientation are plotted in the color coded map on the right side and as cubes within the mapping. (c) Micro-Raman internal stress mapping, maximum compressive stress of −90.5 MPa and tensile stress of 19.2 MPa are determined.
