Material Properties of Laser-Welded Thin Silicon Foils
Figure 5
Cross-section mappings of a keyhole welded sample, three welding areas are illustrated and the laser beam was applied from the top side (a) EBSD mapping, color with respect to the wafer surface, crystal orientations as shown in the color map as well as the included cube (b) Internal stress mapping measured by micro-Raman, maximum compressive stress of −50.0 MPa and tensile stress of 27.5 MPa are measured.
