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International Journal of Photoenergy
Volume 2014, Article ID 809075, 9 pages
Research Article

Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

1Components & Materials Physics Research Center, Korea Electronic Technology Institute, No. 68, Yaptap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-816, Republic of Korea
2School of Photovoltaic and Renewable Energy Engineering, University of New South Wales, Sydney, NSW 2052, Australia
3Department of Materials Science and Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-701, Republic of Korea

Received 31 July 2014; Revised 16 October 2014; Accepted 9 December 2014; Published 22 December 2014

Academic Editor: Ahmad Umar

Copyright © 2014 Ju-Hee Kim et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV) modules, as connection degradation contributes to the increase in series resistance () of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox) reaction under damp heat (DH) conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of . The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.