Research Article
Design, Development, and Analysis of a Densely Packed 500x Concentrating Photovoltaic Cell Assembly on Insulated Metal Substrate
Table 3
Thicknesses and materials for the modelled substrates.
| Layer | PCB | DBC | IMS |
| Interconnectors | 0.025 mm Ag | 0.025 mm Ag | 0.025 mm Ag | Cell | 0.190 mm Ge | 0.190 mm Ge | 0.190 mm Ge | Solder paste | 0.125 mm solder | 0.125 mm solder | 0.125 mm solder | Conductive layer | 0.035 mm Cu | 0.30 mm Cu | 0.035 mm Cu | Dielectric | 4.5 µm marble resin | 0.63 mm AlN | 4.5 µm marble resin | Heat sink | 1.6 mm FR-4 | 0.30 mm Cu | 1.6 mm Al | Reference | [38] | [39] | [40] |
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