Design, Development, and Analysis of a Densely Packed 500x Concentrating Photovoltaic Cell Assembly on Insulated Metal Substrate

Table 3

Thicknesses and materials for the modelled substrates.

Layer	PCB	DBC	IMS
Interconnectors	0.025 mm Ag	0.025 mm Ag	0.025 mm Ag
Cell	0.190 mm Ge	0.190 mm Ge	0.190 mm Ge
Solder paste	0.125 mm solder	0.125 mm solder	0.125 mm solder
Conductive layer	0.035 mm Cu	0.30 mm Cu	0.035 mm Cu
Dielectric	4.5 µm marble resin	0.63 mm AlN	4.5 µm marble resin
Heat sink	1.6 mm FR-4	0.30 mm Cu	1.6 mm Al
Reference	[38]	[39]	[40]