Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane

Table 3

Parameters of reaction kinetics of different adhesive samples.

Samples	Temperature (°C)	Fitting equation	Activation energy (kJ·mol^-1)	Preexponential factor (s·mol·l^-2)	Correlation coefficient
SFA	52~147		46.98		0.9848
	147~387		30.58		0.9311
SFA-WPU5	57~146		82.98		0.9723
	146~257		88.09		0.9921
	257~357		49.9		0.983
	357~417		54.11		0.9866
SFA-WPU10	54~149		78.63		0.9647
	149~267		80.31		0.922
	267~347		47.13		0.9919
	347~450		78.62		0.9743
SFA-WPU15	50~135		80.97		0.9816
	135~242		80.23		0.9746
	242~380		49.11		0.9911
	380~481		89.11		0.991
SFA-WPU20	55~134		72.8		0.9603
	134~253		85.74		0.961
	253~385		44		0.9519
	385~488		100.78		0.9723