Architecture-Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software-Supported Methodology

Table 1

Comparison between alternative design implementations.

Property	Single chips	System-on-chip (SoC)	3D integration
Modular flexibility	High	Low	Medium
System performance	Low	Medium-High	High
Physical dimension of products	Large	Medium	Small
Complexity of fabrication process	Low	Medium-High	Medium-High
Fabrication cost	Low	Medium	High
Design methodology, CAD tools	Available	Available	Not deployed yet