Marginal Sealing Durability of Two Contemporary Self-Etch Adhesives

Table 1

Adhesive resins used, their compositions, and their mode of application according to the manufacturers instructions.

Adhesive resin and manufacturer	Materials compositions	Manufacturers directions
BB (one-step self-etch adhesive, Shofu company)	Bis-GMA, TEGDMA, phosphonic acid monomer, carboxylic acid monomer, acetone, and water	Leave bonding for 10 sec. Air dry with gentle air for about 3 sec, and then dry with stronger air until a thin and uniform bonding layer is obtained. Light-cure for 10 sec with a dental curing light unit, Halogen (irradiation wave length: 400–500 nm, light intensity: >500 mW/s)
CPB (two-step, self-etch adhesive, pH = 2.5, Kuraray, Osaka, Japan)	Primer: water, MDPB, HEMA, dimethacrylates, and photoinitiator Bonding resin: MDP, HEMA, dimethacrylates, silanted, colloidal silica and sodium fluoride	Apply primer gently on the surface and leave undisturbed for 20 seconds. Gently air blow. Apply bond. Air-thin and light-cure for 10 seconds

HEMA: hydroxyl ethyl methacrylate; MDPB: methacryloyloxydodecylpyridinium bromide; MDP: methacryloxydecyl dihydrogen phosphate; CPB: Clearfil Protect Bond; BB: BeautiBond.