| Sample | Substrate | Pretreatment method | C2H2 flow rate (sccm) | H2 flow rate (sccm) | SF6 flow rate (sccm) | Total pressure (torr) | Total deposition times (min) | Source gases flow time (min) | Substrate temp. (°C) | C2H2 | H2 | SF6 |
| A | SiO2 | Method-A | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | B | SiO2 | Method-B | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | C | SiO2 | Method-C | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | D | SiO2 | None | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | E | Ni-SiO2 | Method-D | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | F | Si | Method-A | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | G | Si | Method-B | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | H | Si | Method-C | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | I | Si | None | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 | J | Ni-Si | Method-D | 15 | 35 | 35 | 100 | 10, 60 | 10, 60 | 10, 60 | 5 | 750 |
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