Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Figure 5

SEM photomicrographs of electrodeposited copper samples. Key: added [Co²⁺]_o  X ppm + [Cl⁻]_o  Y ppm (a) 0 + 5 ppm; (b) 0 + 100 ppm; (c) 150 ppm + 5 ppm; (d) 150 ppm + 10 ppm; (e) 150 ppm + 50 ppm; (f) 150 ppm + 100 ppm (Cu²⁺ = 20 g/L, H₂SO₄ = 30 g/L, 𝑇=30±1°C, CD = 150 A/m², 𝑡_𝑑 = 2 hr).